Electroless Copper Plating Using Glyoxylic Acid as a Reducing Agent.
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چکیده
منابع مشابه
Copper electroless plating in weakly alkaline electrolytes using DMAB as a reducing agent for metallization on polymer films
Copper electroless plating at low pH (7–9) using dimethylamine borane complex as a reducing agent is studied electrochemically by linear sweep voltammetry, cyclic voltammetry and chronopotentiometry in full electrolytes. We find that the mixed potential theory is not applicable to the described system. We show that both the working potential and the rate-controlling mechanism are dependent on t...
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ژورنال
عنوان ژورنال: Journal of the Surface Finishing Society of Japan
سال: 1991
ISSN: 0915-1869,1884-3409
DOI: 10.4139/sfj.42.913